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Precautions With Use For LCD Modules

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The following procedures should be followed when soldering the LCM:


Solder is to be applied only to the I / O terminals.
Use a soldering iron with no leakage.

In addition, further attention should be paid to the following.


Conditions for soldering I / O terminals:

Temperature at iron tip: 280oC + 10oC
Soldering time: 3-4 sec. / terminal
Type of solder: Eutectic solder ( rosin flux filled )
Avoid using flux, since it may penetrate the LCM and could possibly cause contamination.
When cleaning is required do not remove the protective film until after soldering the I / O terminals has been completed.This will eliminate contamination with by the dispersion of flux where soldering.


Removing the wiring:

When a lead wire or a connector that has been soldered to the I / O terminals of the LCM is to be removed ,do so only after the solder at the connection has sufficiently melted. If this wire or connector is forcefully removed, it may cause the terminal to break or peel. It is recommended that a suction-type soldering iron be used. Do not attempt to solder a lead wire or connector more than 3 times to a given LCM.




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